Liquid Fluxes & Thinners | VOC Free, Water Soluble, Rosin Based & Colophony Free

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Liquid Fluxes and Thinners

Liquid Fluxes and Thinners

Warton manufacture a range of liquid fluxes designed to suit the various processes, solderability and cleaning requirements of today’s electronics industry. Warton fluxes are manufactured for lead free and lead processes and include VOC free, water soluble, rosin based and colophony free fluxes.

To request a datasheet, or if you require further information please contact us.

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Product Description Use Properties Solids Content Specific Gravity
nexus
NXF 606-36
A halogen free, water based, VOC Free spray flux formulated for lead free wave and selected soldering operations. NXF-606 provides excellent defect free soldering of even the most difficult to solder components and board finishes, including OSP, ENIG, Ag, Sn and HASL. NXF-606 leaves the absolute minimal on non greasy post soldering residue. NXF-606 can be applied by spray, wave or brush. Lead Free & selective soldering operations No Halide
No Halogen
Rosin Free
VOC Free
No Clean

ORL0
J-STD-004B
3.9 1.012 @ 25°C
nexus
NXF 700-30
A halogen free, water based VOC Free spray flux formulated for lead free wave and selected soldering operations. NXF-700 provides excellent defect free soldering of even the most difficult to solder components and board finishes. Powerful wetting with exceptional cleanliness NXF 700-30 has superior hole fill, no solder balling and is rosin and resin free. Spray Flux for Lead Free wave and selective soldering operations No Halide
No Halogen
Rosin Free
VOC Free
No Clean

ORL0
J-STD-004B
3.8 1.013 @ 25°C
nexus
NXF 707-32
A VOC Free spray flux for defect free soldering of even the most difficult to solder assemblies. NXF 707-32 gives exceptional cleanliness, with a wide process window and is rosin and resin free. Spray Flux for Lead Free wave and selective soldering operations No Halide
VOC Free
Rosin Free
No Clean

ORL0
J-STD-004B
3.9 1.012 @ 25°C
nexus
NXF 808-34
A water based, non flammable VOC Free spray flux for exceptional cleanliness. NXF 808-34 has sustained activity for dual wave and superior hole fill with no solder balling. NXF 808-34 can be applied by spray, wave or brush. Spray Flux for Lead Free wave and selective soldering operations No Halide
VOC Free
Rosin Free
No Clean

ORL0
J-STD-004B
5.2 1.014 @ 25°C
nexus
NXF 808-34-F
A water based, non flammable VOC Free foaming flux for exceptional cleanliness. NXF 808-34-F has superior hole fill with no solder balling. Foam Flux No Halide
VOC Free
Rosin Free
No Clean

ORL0
J-STD-004B
5.2 1.014 @ 25°C
ecowave
Ecowave 41
A no clean colophony and halide free flux suitable for spray or foam fluxing systems. Ecowave 41 offers excellent solderability, with minimal residue. For conventional, mixed and surface mount technologies, telecommunications, computer and general consumer electronics. No Clean
Halide Free
Rosin Free
1.7% 0.805 @ 20°C
ecowave
Ecowave 45
Ecowave 45 is a low solids VOC Free no clean flux free from halide or colophony. High activity, defect free soldering. Excellent wetting for hole fill. Low, non tacky residue reduces interference with pin testing and board cosmetics. For spray applications. No Clean
VOC Free
Halide Free
Colophony Free
4% 1.04 @ 25°C
ecowave
Ecowave 44
A low residue, no clean flux suitable for most no clean professional soldering applications. For conventional, mixed and surface mount technologies, telecommunications, computer and general consumer electronics. No Clean
Halide Free
Rosin Free
2.5% 0.945 @ 20°C
ecowave
Ecowave 33
A low residue no clean flux suitable for spray or foam fluxing systems. Ecowave 33 offers excellent solderability with the minimal level of flux residue. For conventional, mixed and surface mount technologies, telecommunications, computer and general consumer electronics. No Clean
Halide Free
Rosin Free
2.5% 0.810 @ 20°C
ecowave
Ecowave 23
A rosin based no clean flux for professional soldering applications. Ecowave 23 improves soldering performance (no bridge and icicles) but also reduces cost, as cleaning is not necessary. For conventional, mixed and surface mount technologies, telecommunications, computer and general consumer electronics. No Clean
Halide Free
4% 0.795 @ 20°C
ecowave
Ecowave 42
A 2.5% solids no clean, colophony and halide free flux suitable for spray and foam fluxing systems. For conventional, mixed and surface mount technologies, telecommunications, computer and general consumer electronics. No Clean
Halide Free
Rosin Free
2.5% 0.850 @ 20°C
ecowave
Ecowave 42B
A colophony free, low residue no clean flux suitable for most professional soldering applications. For conventional, mixed and surface mount technologies, telecommunications, computer and general consumer electronics. No Clean
Halide Free
Rosin Free
1.7% 0.850 @ 20°C
future
Future 315
A low residue, 2% low solids, no clean flux excellent for rework applications. Future 315 not only improves soldering performance (no bridges or icicles) but also reduces cost as no cleaning is necessary. For conventional, mixed and surface mount technologies, telecommunications, computer and general consumer electronics.
Ideal for re-work.
Halide Free
Colophony Free
No Clean
2% 0.805 @ 20°C
future
Future 380F
A low residue no clean flux, colophony free and halide free flux. For conventional, mixed and surface mount technologies, telecommunications, computer and general consumer electronics.
Ideal for re-work.
Halide Free
Colophony Free
No Clean
2.4% 0.810 @ 20°C
future
Future 380S
A low residue no clean spray version of Future 380S which require less residue and greater SIR values then conventional low solids no clean fluxes. For conventional PTH technology, telecoms, computer and general consumer electronics. Halide Free
Colophony Free
No Clean
2.5% Not applicable
Aqua Pro 400
A no clean spray flux, free from colophony and halide and volatile organic compounds. For conventional PTH technology, telecoms, computer and general consumer electronics. VOC Free
Halide Free
Colophony Free
2% 1.00
Aqua Pro 406
A no clean VOC free flux. Aqua Pro 406 offers excellent solderability. For conventional PTH technology, telecoms, computer and general consumer electronics. VOC Free
Halide Free
Colophony Free
2% 1.00
Hardcore 202
A 3.5% solids no clean, non corrosive flux suitable for spray and foam fluxing systems. For conventional PTH technology, telecoms, computer and general consumer electronics. 0.5% Halide
1.5% Colophony
3.5% 0.810 @ 20°C
Hardcore 202HF
A 3.5% solids no clean flux with a slight addition of rosin. For conventional PTH technology, telecoms, computer and general consumer electronics. Halide Free
1.5% Colophony
3.5% 0.810 @ 20°C
Hardcore 205
A 6% solids no clean, non corrosive flux for spray and foam applications. For conventional PTH technology, telecoms, computer and general consumer electronics. Halide Free
4% Colophony
6% 0.810 @ 20°C
Hardcore 206
A 10% solids no clean, no corrosive flux suitable for most no clean soldering applications. For conventional PTH technology, telecoms, computer and general consumer electronics. Halide Free
8% Colophony
10% 0.806 @ 20°C
Hardcore 209
A 15% solids no clean, non corrosive flux for spray and foam fluxing systems. For conventional PTH technology, telecoms, computer and general consumer electronics. Halide Free
14% Colophony
15% 0.825 @ 20°C
Hardcore 217
A halide free, no clean flux suitable for spray or foam applications. For conventional PTH technology, telecoms, computer and general consumer electronics. Halide Free
19% Colophony
20% 0.840 @ 20°C
Hardcore 222
A 15% solids no clean, non corrosive flux suitable for spray or phone fluxing systems. For conventional PTH technology, telecoms, computer and general consumer electronics. 0.5% Halide
19% Colophony
15% 0.825 @ 20°C
Hardcore 229
A 20% solids flux suitable for spray or foam applications. For conventional PTH technology, telecoms, computer and general consumer electronics. 0.5% Halide
19% Colophony
20% 0.840 @ 20°C
Hardcore 233
A 25% solids no clean, non corrosive flux suitable for spray and foam fluxing systems. For conventional PTH technology, telecoms, computer and general consumer electronics. 0.5% Halide
19% Colophony
25% 0.860 @ 20°C
Hydro Flux 532
A water soluble colophony free flux, with superior wetting. Hydro flux residues must be removed. Hydro Flux 532 Water Wash Flux is suitable for conventional, mixed and surface mount technologies. For telecommunications, computer and general consumer electronics. Halide Free
Colophony Free
2.5% 0.952 @ 20°C
Dipping Flux DF1
A dipping flux containing rosin and alcohol which exhibits non corrosive residues. DF1 offers excellent solderability on copper, nickel, silver, gold, tin and soldered surfaces. Suitable for transformer, cable and general dipping applications. 0.5% Halide 37.5% 0.887 @ 20°C
Dipping Flux DF3
DF3 promotes fast wetting and gives a bright solder coating. DF3 will have a brightening effect on heavily oxidized copper. The exceptional water solubility makes complete cleaning easy. Suitable for transformer, cable and general dipping applications. 1.2% Halide 6% -
Dipping Flux DF5
DF5 removes oxides and prevents their formation during the soldering operation. A hard, protective, non corrosive insulating residue is left on the soldered joints. Suitable for transformer, cable and general dipping applications. Halide Free 50% 0.921 @ 20°C
Thinners 1000
A flux thinners to be used with Future 380F and 380S. Flux Thinners - - -
Thinners 2000
A flux thinners for use with Future 315, Hardcore Fluxes, DF1 and DF5. Flux Thinners - - -

Packaging

Available in 100ml bottle, 0.5 litre, 1Litre, 5 Litre, 10 Litre, 25 Litre, 205 Litre containers.


The Company warrants only that the Goods will correspond as to the quality and description with the Company’s own specifications as set out in each product data sheet and all other terms conditions or warranties relating to the quality and/ or fitness for any particular purpose whether express or implied are excluded to the fullest extent permitted by law. It is therefore the Buyers responsibility to satisfy itself by inspection and testing of samples prior to placing any orders as to the purpose for which he requires the Goods and or particular conditions of use that will apply to the Goods and or the suitability or performance of the Goods when used in combination with any other Goods or materials, in any specific environment and in any process. In no event shall the Company be responsible for special, incidental or consequential damages, whether the claim is in contract, negligence or otherwise.

Logos

Nexus
Microprint
Ecowave
Autosol
Omega
Surf Clean