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Total Clean Products


 

Total Clean Products

Total Clean 130 Stencil Cleaner

Total Clean 130 is a CFC free cleaning solution developed to replace Trych’s and to cut down on the use of CFC’s. Total Clean 130 is a stencil cleaner with a moderate evaporation rate for removal of rosin, modified rosin and no clean solder paste.

Applications
Total Clean 130 is virtually odourless, easy to use and ozone friendly.

Packaging
Total Clean 130 is supplied in 500ml trigger bottles and 10 and 25 Litre containers.


Total Clean 200 Bench-Top Flux Residue Remover (Aerosol Container)

Total Clean 200 is a CFC free cleaning solution developed for bench-top removal of flux residues, after the soldering process. Total Clean 200 is a solvent based cleaner and offers greater cleaning power than similar isopropanol cleaners, which can leave conductive and corrosive white organic powders after evaporation. Total Clean 200 will dissolve most flux ingredients quickly and efficiently, leaving assemblies cleaner than normal cleaning agents.
Total Clean 200 is easy to use, fast evaporating and ozone friendly. Total Clean 200 leaves no residue, making it ideal for all those applications where a lubricant is unsuitable.
Total Clean 200 is safe on most plastics, fabrics and surface coatings although you should always test for material compatibility before using cleaners on a commercial scale.

Application
1. Fix applicator to the front of the spray nozzle.
2. Spray area required to be cleaned.
3. If required use a soft bristle brush to help penetrate difficult hardened or aged residues (brush attachment supplied with each aerosol container).
4. Rinse with fresh cleaning agent.
5. Repeat procedure until no residues are present.
Typical Uses
For the removal of Rosin No Clean, Rosin Free No Clean and Resin based flux residues after soldering.
Packaging
Supplied in 400ml Aerosols.


Total Clean 300 Total Submersion Cleaner

Total Clean 300 is a blend of oxygenated solvents free from CFC’s. Total Clean 300 is completely miscible in water and is biodegradable.
Total Clean 300 removes RMA, Synthetic Resin and Rosin Free flux types from printed circuit boards. Total Clean 300 has a low surface tension, ensuring efficient penetration and cleaning under SMT Components.
Total Clean has a high flash point and low vapour pressure which helps to make it safe and easy to handle. It works at low operating temperatures and is a clear, colourless liquid with only a mild solvent odour.

Process Information
Total Clean 300 can be used in in-line or stage batch cleaning processes. Total Clean 300 can be used as a solvent only system or semi aqueous system. A minimum of 1 wash cycle, 2 rinse cycles and an effective forced air or vacuum drier is recommended.
 

Wash

Rinse

Rinse

Dry

Total Clean only

Total Clean 300

Total Clean 300

Total Clean 300

Dry

Semi-aqueous system

Total Clean 300

Water

De-ionised water

Dry

Total Clean 300 Process Stages

Wash
The consistency of cleaning results can be improved by operating at 30-60° C, the use of agitation, e.g. ultrasonics spray under immersion.
The length of time required to achieve effective cleaning will depend on the operating conditions and the contamination to be removed. With high power ultrasonics at 50° C, 3 minutes is usually sufficient. Lower power ultrasonics or spray under immersion may require longer wash times (5-7 minutes). Replace when Total Clean 300 reaches 15%wt contamination.

Rinse
A minimum of 2 rinses, each lasting one minute, is recommended.
The cleanliness of the final Total Clean rinse or water rinse should be maintained by re-circulating through ion exchange and activated carbon packs.

Dry
Forced air or vacuum drying is recommended. For Total Clean only systems a maximum temperature of 85° C is recommended.

Waste removal
Contact your local authority for advice on registered waste contractors. Total Clean 300 does have value as a secondary fuel to cement kiln operators. Total Clean 300 has a calorific value of ca.7400Kcal/Kg.

Material compatibility
Total Clean 300 is compatible with:
  • High / Low density polyethylene HDPE / LDP
  • Linear LDPE, Polypropylene, Nylon, Butyl ethylenepropylene rubber, Poly ether ether ketone PEEK, Polyethersulphone, Phenolic resins
Packaging
Total Clean 300 is available in 10 litre, 25 litre and 205 litre containers.


Total Clean 500 Concentrate Cleaner

Total Clean 500 Concentrate is a CFC free cleaning solution designed for use in ultrasonic cleaning or spray and immersion systems. Total Clean 500 is ideal for removing a wide range of saponifiable and water soluble fluxes from PCBs, leaving bright, shiny solder joints.
Total Clean 500 contains a careful blend of solvents and emulsifiers which are 100% Ozone friendly. Total Clean 500 has a biodegradable solvent blend - designed to clean PCB flux residues to military cleanliness standards. It is recommended that Total Clean 500 is used as a 5-10% solution in water. The blend of solvents that make up Total Clean 500 dissolve all types of organic residues (including flux and grease) and inorganic material, quickly and efficiently. Its modified surface tension ensures that all areas of the board are cleaned, including underneath surface mounted components and connectors down to 40 micron stand off. Total Clean 500 is equipped with an indicator system that warns the user when the cleaning solution is exhausted -this eliminates titration checks. The colour change is from pale blue to pale yellow .

Physical Properties
Boiling Point......................>100ºC
Freezing Point...................-5ºC
Specific Gravity.................1.5 g/cm³
Flashpoint.........................>100° C
Process Information

Total Clean 500 may attack some metals (such as aluminium, copper, brass etc.), if allowed to soak for more than 15 minutes, or under repeated usage.
Total Clean 500 when diluted, is designed to be used in three and four stage machines consisting of:- Ultrasonic wash or spray under immersion in Total Clean 500, Rinse (Tap Water), Rinse (de-ionised) if required and Hot Air Dry. A diluted version of Total Clean 500, named Total Clean 505 is available ready for use. Call customer services for more information.
1). Ultrasonic Wash
Total Clean 500 diluted in the first tank removes organic residues (grease, flux etc.) and ionic material and prevents re-deposition of dirt on the PCB. Total Clean 500 is designed to clean underneath Surface Mount Devices (SMDs) and thus shortens the cleaning time to approximately 3 minutes (with Ultrasonic agitation).
Total Clean 500 absorbs very high levels of flux residues before cleaning efficiency decreases. 1 litre of Total Clean 500 Concentrate will remove 1.6 Kg of rosin.
The first stage, although ideally ultrasonic, could use any form of agitation provided it does not damage the PCB or create over-foaming. Total Clean 500 is designed to work efficiently at 55ºC to 60° C. An existing CFC based tank can often be used for this stage.
During use, the diluted Total Clean 500 becomes increasingly exhausted and its pH falls to 5.6 and below. The colour of the solution changes from pale blue to pale yellow. At this stage, replenishment with Total Clean Concentrate will restore the solutions pH. Alternatively, freshly diluted Total Clean 500 can replace the exhausted one.

2). Tap Water Rinse
The second stage consists of a rinse in tap water preferably with sonic agitation. The temperature of the rinsing solution should be ambient.
Every time a PCB is removed from the cleaning tank, some Total Clean 500 is carried over into the rinse water. To prevent the rinse water becoming increasingly more contaminated, the rinse water should either be allowed to overflow to drains or be recycled through a carbon filter. If allowed to go to a drain, your local water authority should be consulted to ensure that the level of contaminated water being put to drain is within their guidelines.

3). De-ionised Rinse
The third stage is a de-ionised water rinse. This removes any contamination present in the tap water from the PCB and gives a final polish to ensure exceptional cleanliness. This stage may either consist of a re-circulating rinse or a spray system that is activated when the PCB’s leave the tap water rinse. If MIL STD cleanliness is not required, this de-ionised rinse may not be necessary, though the PCBs may show some white streaking due to tap water impurities.

4). Drying 
The final stage is drying. This is enhanced by equipment that uses high air flow as opposed to heat only systems. In general, this stage takes approximately 5 minutes at 90ºC. The length of time required to dry the PCB depends on the circuit design and the efficiency of the drying unit itself. Air knives can be used as an optional extra to reduce temperature or total energy required.
Usage Losses By Drag - Out
PCB’s leaving the cleaning stage carry the diluted Total Clean solution into the rinse tank. Replenishment is required to maintain the same volume of cleaning solution.
Typical figures for drag out are as follows:
  • PCB Drag-out (Without Air Knife) - 100ml/m
  • PCB Drag-out (With Air Knife) - 20-50ml/m
Waste Removal
Total clean 500 should be disposed of at your local sewage farm, with local authority permission.
Packaging
Total Clean 500 is available in 10 litre, 25 litre and 205 litre containers.


Total Clean 505 Saponifier Cleaner
Total Clean 505 Saponifier is a CFC free cleaning solution designed for use in ultrasonic cleaning or spray and immersion systems. Total Clean 505 is ideal for removing a wide range of saponifiable and water soluble fluxes from PCBs, leaving bright, shiny solder joints.
Total Clean 505, is water based, non flammable, 100% Ozone friendly. Total Clean 505 has a biodegradable solvent blend - designed to clean PCB flux residues to military cleanliness standards. Total Clean 505 is packaged in a concentration suitable for immediate use - further dilution is not required.
Total Clean 505 is fully soluble in water and easily rinsed. The blend of solvents that make up Total Clean 505 dissolve all types of organic residues (including flux and grease) and inorganic material, quickly and efficiently. Its modified surface tension ensures that all areas of the board are cleaned, including underneath surface mounted components and connectors down to 40 micron stand off. 
Total Clean 505 is equipped with an indicator system that warns the user when the cleaning solution is exhausted -this eliminates titration checks. The colour change is from pale blue to pale yellow.

Physical Properties
Boiling Point...........................................98ºC
Freezing Point........................................-5ºC
Specific Gravity...................................1.002 g/cm³
Flashpoint...............................................None
Process Information

Total Clean 505 may attack some metals (such as aluminium, copper, brass etc.), if allowed to soak for more than 15 minutes, or under repeated usage.
Total Clean 505 is designed to be used in three and four stage machines consisting of:- Ultrasonic wash or spray under immersion in Total Clean 505, Rinse (Tap Water), Rinse (De-ionised) if required and Hot Air Dry.
1). Ultrasonic Wash
Total Clean 505 in the first tank removes organic residues (grease, flux etc.) and ionic material and prevents re-deposition of dirt on the PCB. Total Clean 505 is designed to clean underneath Surface Mount Devices (SMDs) and thus shortens the cleaning time to approximately 3 minutes (with Ultrasonic agitation).
Total Clean 505 absorbs very high levels of flux residues before cleaning efficiency decreases. 1 litre of Total Clean 505 will remove 80g of rosin. The first stage, although ideally ultrasonic, could use any form of agitation provided it does not damage the PCB or create overfoaming. Total Clean 505 is designed to work efficiently at 55ºC to 60° C. An existing CFC based tank can often be used for this stage. As PCBs are removed from the Total Clean 505 cleaning stage, a small amount of Total Clean 505 fluid is pulled out with the board and enters into the rinse stage. After a period of time, dependent on the volume of PCBs being cleaned, the level in the cleaning tank decreases to a pointwhere an additional five litres of new Total Clean 505 can be added to the cleaning tank. The periodic addition of new Total Clean 505 to replace the material that is pulled out will normally ensure that the cleaning effect of the solution is never reduced to an unacceptable level (below MIL-P-28809A).This means the disposal of the material is not required.

2). Tap Water Rinse
The second stage consists of a rinse in tap water preferably with sonic agitation. The temperature of the rinsing solution should be ambient.
Every time a PCB is removed from the cleaning tank, some Total Clean 505 is carried over into the rinse water. To prevent the rinse water becoming progressively more contaminated as time goes on, the rinse water should either be allowed to overflow to drains or be recycled through a carbon filter. If allowed to go to a drain, your local water authority should be consulted to ensure that the level of contaminated water being put to drain is within their guidelines.

3). De-ionised Rinse
The third stage is a de-ionised water rinse. This removes any contamination present in the tap water from the PCB and gives a final polish to ensure exceptional cleanliness. This stage may either consist of a re-circulating rinse or a spray system that is activated when the PCB’s leave the tap water rinse. If MIL STD cleanliness is not required, this de-ionised rinse may not be necessary, though the PCBs may show some white streaking due to tap water impurities.

4). Drying
The final stage is drying. This is enhanced by equipment that uses high air flow as opposed to heat only systems. In general, this stage takes approximately 5 minutes at 90ºC. The length of time required to dry the PCB depends on the circuit design and the efficiency of the drying unit itself. Air knives can be used as an optional extra to reduce temperature or total energy required.
Usage Losses By Drag - Out
PCB’s leaving the cleaning stage, carry the diluted Total Clean solution into the rinse tank. Replenishment is required to maintain the same volume of cleaning solution. Typical figures for drag out are as follows:
  • PCB Drag-out (Without Air Knife) - 100ml/m
  • PCB Drag-out (With Air Knife) - 20-50ml/m

Waste Removal
The disposal of exhausted Total Clean 505 often does not arise because of the drag-out effect. In this situation only the rinse stage water has to be disposed of at your local sewage farm, with Local Authority permission.

Packaging
Total Clean 505 is available in 10 litre, 25 litre and 205 litre containers.

ISOQAR and UKAS Certification Future Autosol High Speed Cored Solder Wire  for automated and high speed soldering Ecowave Wave Soldering Flux Omega Rosin Free ProductsMicroprint Slump Free No Clean  Solder Paste Total Clean CFC Free Cleaning Solution

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