|
Solder Paste comes in a variety of forms, no clean, water wash, rosin free, extended tack & stencil life
and clear residue solder pastes - manufactured to meet the quality required for
today's electronics industry. Pastes are manufactured in standard
tin/lead alloys and lead free alloys, with various particle sizes and
viscosities. |
|
|
P2003 No Clean Solder Paste
is a Halide Free product formulated for inert and aerobic
applications. Future P2003 is designed for applications requiring excellent
printability with extended tack and board/stencil life and excellent slump resistance.
Future P2003 offers rapid efficient soldering of even the most difficult of assemblies,
leaving only minimal clear residue after reflow. Future P2003
is available as Warton High Purity Sn63, Sn96 and Sn62, Lead Free TSC, Sn10 and Sn5 |
|
| Selection Criteria |
- High Purity Solder Alloy
|
- Physical Properties
|
- Powder Size
|
- Paste Viscosity
|
|
| High Purity Solder Alloy |
| In 1994 a single European standard, EN 29453 (ISO 9453), superseded all
other European national standards, BS 219, DIN 1707, NFC
90-550. Other standards include QQS 571E, ASTM B32 and
JIS-Z-3382. |
|
| Physical Properties |
| Melting range ΊC-Sn63 (183) Sn62 (179)Sn96 (221) Lead Free TSC (217) Sn10Pb88Ag2 (268-290) Sn5Pb92.5Ag2.5 (287-296 |
| Metal Content (Stencil Printing)...............
..:89% |
| Metal Content ( Dispensing)
..
85% |
| Metal Content Lead Free TSC
...87% |
| Metal Content Sn10Pb88Ag2/Sn5Pb92.5Ag2.5..90% |
| Flux Specification......................
..:Halide free (J-STD-004 Type ROLO) |
| Tack Time 40%RH - 72hr, Open Time 40%RH greater than 72hr |
| Print Life
: greater than 24hr |
|
| Powder Size - microns |
| 25 - 38 |
| Suitable for Fine Pitch Components |
|
| Viscosity |
| Future P2003 is available in a viscosity range of 600-800 pa. |
|
| Packaging |
| Future P2003 is available in 0.25kg Semco Cartridges,
0.5Kg Semco Cartridges, 0.75Kg Semco Cartridges, 0.5kg and 1.0Kg Tubs. |
| 40g Semco Syringes, 40g EFD Syringes |
| 75g Semco Syringes, 75g EFD Syringes |
| 125g Panasert Syringes, 100g Panasert Syringes |
|
| Ideal Storage Conditions For |
| Future P2003 has a shelve life of at least six Months
providing it is stored at the recommended storage temperature of 5 - 10 Deg C |
| Syringes, EFD , Panasert and Semco have shelf live of 3 months at the same conditions |
|
|
Avoid Common Mistakes Made With Solder Pastes |
| Before using the product in a production environment, it is important that you understand and have read all Health and Safety
material datasheets despatched with the product and are aware of good working practices.
Make sure the stencil is clean of spent of old material.
Clean the stencil with a LINT FREE underside wipe (see Warton underside wipes for free trial) around every 15 prints |
|
- Using Material Straight From The Fridge
|
| Ensure the Paste is at room temperature before opening
Doing so will prevent moisture ingress into the product by condensation
Ensure the paste is rolling smoothly on the Blades Before printing on production boards
, usually around 5 prints, on the sixth print, inspect the print for slumping and Aperture bridging |
|
- Do Not Use Out Of Date Material
|
|
- Make sure the Profile is Correct
|
| The most obvious physical sign that the Oven Profile is incorrect
is the presence Solder Balling, Bridging of Fine Pitch Components and Residue Spread. |
|
- Try to avoid the use of very old and highly oxidised components
|
|
- Try to avoid Intervals of greater than 2 days between Printing and Board Population
|
|
|
|
