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Solder Paste - Microprint Slump Free No Clean 

Microprint Slump Free No Clean 

Microprint is a rosin based solderpaste range which allows a previously unseen level of repeatability and consistency.  Not only can this new solder paste technology offer the next step in process yield optimization, this technology heralds the way for  lead free ready flux activation and gel/temperature stability.

Microprint solder paste has been carefully formulated to offer the maximum in performance on tin/lead, copper, gold, nickel and silver based substrate materials, to ensure optimum solderability and minimum process difficulties when using either Sn62, Sn63, or lead free alternatives (Sn96 or Warton lead free TSC (Sn/Ag/Cu) offering a melting point of 217°C).  

Microprint is available in a particle size distribution of 15-32µm or 25-53µm - offering repeatable print performance for all aperture sizes including 0.6mm QFP's to below 0.3mm µBGA's.

Microprint Datasheets  

      Useful Profiles For Microprint P2004

Product Ranges Include:

Microprint P2004

Microprint P2005 L1

Microprint NCJW0

Microprint NCJW1

Batch To Batch Consistency

Microprint uses a unique gel system, resulting in greater batch to batch consistency.  This user friendly system simplifies the set-up and control of the print process.

Greater Print Definition

Microprint's small particle size of 15-32µm (-450+600 mesh), guarantees repeatable print definition to below 0.3mm for µBga work.

Eliminates Costly Rework

Microprint helps eliminated mid chip and micro balling, therefore eliminating costly rework.

Independently Tested Trace Laboratories

Independently tested by a recognised test house to ensure 'no clean' status in accordance with J-STD-004.

Please find Trace Laboratories report below:-

Trace Laboratories Report

Lead Free Ready

Microprint's unique gel and 'no clean' activation system insures excellent results with lead alloys 96S and Warton's low melt point TSC alloy (217°C), enabling a hassle free change over to lead free technologies.

Slump Free Solder Paste

Microprint offers slump free processing.

   Microprint Slump Free                     Competitor Slump Performance

Microprint P2004 Slump Performance         Competitor Slump Performance

Packaging

Microprint is available in 0.25Kg, 0.5Kg tubs, 40g and 75g syringes, 0.5Kg and 1Kg cartridges, Pro Flow cartridges and Paste Puck systems.

To request a datasheet or to ask a representative to contact you,  please click on the INFORMATION REQUEST FORM , or PLEASE PHONE ME TODAY ,E.mail sales@warton-metals.co.uk or phone: +44 (0)1706 218888.

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Microprint P2004

Click here to see the Microprint range of no clean solder paste

 


Warton Metals Limited Grove Mill Commerce Street Haslingden Lancashire BB4 5JT England Telephone: +44 (0)1706 218888 Fax: +44 (0)1706 221188 E.mail: sales@warton-metals.co.uk

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