Microprint is a rosin based solder paste range, which allows
a previously unseen level of repeatability and consistency.
Not only can this new solder paste technology offer the
next step in process yield optimisation, this technology
heralds the way for lead free ready flux activation and
gel/temperature stability.
Microprint
has been carefully formulated to offer the maximum in performance
on tin/lead, copper, gold, nickel and silver based substrate
materials, to ensure optimum solderability and minimum process
difficulties when using either Sn62, Sn63, or lead free
alternatives (Sn96 or Warton lead free TSC (Sn/Ag/Cu) offering
a melting point of 217°C).
Microprint
is available in a particle size distribution of 15-32µm
or 25-53µm - offering repeatable print performance
for all aperture sizes including 0.6mm QFP's to below 0.3mm
µBGA's.
Microprint
is available in three product ranges:
Microprint is lead free ready, click for more information
The
Future range of no clean solder pastes are designed for
applications requiring extreme low slump, no solder balling,
excellent printability with long tack/stencil life.
Future
Paste, offers rapid efficient soldering of even the most
difficult of assemblies, leaving only minimal clear residue
after reflow. Future is formulated for nitrogen and air
reflow processes and is available with both activated and
halide free flux formulations and in Lead Free (Lead free
TSC and Sn96) and conventional lead based alloys (Sn62 and
Sn63).
