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Warton manufacture a range of solder pastes to meet the
quality required for today's electronics industry. Paste ranges include:-
Warton Solder Pastes (Alloys &
Properties)
| Warton part No. |
Alloy |
En 29453 |
QQS 571E |
BS 219 |
Melting Range °C |
| Sn62 |
Sn
61.5 - 62.5 Pb
Remainder Ag 1.8-2.2 |
30 |
Sn62Pb36Ag2 |
62S |
179 |
| Sn63 |
Sn
62.5-63.5 Pb Remainder |
1a |
- |
AP |
183 |
| Lead Free TSC |
Sn
95.5-96
Cu
0.5-1
Ag 3.3-4 |
- |
- |
- |
217 |
| Sn96 |
Sn
Remainder Ag 3.5-4.0 |
28 |
Sn96Ag4 |
96S |
221 |
Solder pastes are available in 0.25Kg, 0.5Kg 1Kg and 5Kg
tubs, 0.5Kg and 1Kg cartridges, 25, 35 and 75g syringes.
 Click on the product name to go to the
product page
Microprint
Slump Free Solder Paste
Microprint is a rosin based solder paste range which allows a
previously unseen level of repeatability and consistency. Not only can
this new solder paste technology offer the next step in process yield
optimization, this technology heralds the way for lead free ready flux
activation and gel/temperature stability.
Microprint has been carefully formulated to offer the maximum
in performance on tin/lead, copper, gold, nickel and silver based substrate
materials, to ensure optimum solderability and minimum process difficulties when
using either Sn62, Sn63, or lead free alternatives (Sn96 or Warton lead free TSC
(Sn/Ag/Cu) offering a melting point of 217°C).
Microprint is available in a particle size distribution of 15-32µm or 25-53µm - offering repeatable
print performance for all aperture sizes including 0.6mm QFP's to below 0.3mm µBGA's.
Future Low Residue No Clean Solder Paste
The Future range of no clean solder pastes are designed for
applications requiring extreme low slump, no solder balling, excellent printability with long tack / stencil life.
Future Paste, offers rapid efficient
soldering of even the most difficult of assemblies, leaving only minimal clear
residue after reflow. Future is formulated for nitrogen and air
reflow processes and is available with both activated and halide free flux
formulations and in Lead Free (Lead free TSC and Sn96) and conventional lead
based alloys (Sn62 and Sn63).
P2003
Specifications 
Hydro
Flux Water Wash Solder Paste
A range of colophony free pastes suitable for applications
where washing is necessary. Hydro Flux is available in both nitrogen and
air reflow formulations. Hydro Flux is available in three powder sizes, three
viscosity ranges and in all
Warton High Purity Solder Alloys.
Omega Rosin Free Solder Paste
Omega Rosin Free Solder
Paste is a unique solder paste for applications which require the absolute
minimum of post reflow residue, whilst maintaining the drive for improved health
and safety management. Omega is 'rosin free' and is designed for applications
requiring excellent print definition with long board and stencil life and
extreme low slump. Omega offers rapid efficient soldering of even the most difficult of
assemblies and is formulated to suit Lead Free Soldering, using Warton’s low
melt point ( 217° C ) High Purity TSC Alloy.
To request a datasheet or to ask a representative to
contact you, please click on the INFORMATION
REQUEST FORM , E.mail
sales@warton-metals.co.uk
or phone: +44 (0)1706 218888.
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