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New Product Press Release
Slump Free Solder Paste Warton have released a new solder paste called Microprint P2004. Microprint is a rosin based solderpaste range, which allows a previously unseen level of repeatability and consistency. Not only can this new paste technology offer the next step in process yield optimization, this technology heralds the way for lead free ready flux activation and temperature gel stability. Microprint has been carefully formulated to offer the maximum in performance on tin/lead, copper, gold, nickel and silver based substrate materials, to ensure optimum solderability and minimum process difficulties when using either Sn62, Sn63 or lead free alternatives. Why Microprint P2004? Batch To Batch Consistency Microprint uses an unique gel system, resulting in greater batch to batch consistency. This user friendly system simplifies the set-up and control of the print process. Greater Print Definition Microprint's small particle size of 15-32µm (-450+600 mesh), guarantees repeatable print definition to below 0.3mm for µBga work.
Eliminates Costly Rework Microprint solderpaste helps eliminate mid chip balling and micro balling, therefore eliminating costly rework. Independently Tested Independently tested by a recognized test house to ensure 'no clean status' in accordance with J-STD-004.
Lead Free Ready Microprint's unique gel and 'no clean' activation system ensures excellent results with lead free alloys 96S and Warton's Low Melt Point TSC alloy (217°C), enabling a hassle free change over to lead free technologies. Slump Free Solder Paste Microprint's slump free formulation eliminates solder balling. Further Information For further information on Microprint or any of the other solderpaste products Warton Manufacture, please do not hesitate to contact customer services on Tel: + 44 (0)1706 218888 or Email: microprint@warton-metals.co.uk. |
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