Microprint Range

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Microprint Range of Slump Free No Clean Solder Paste

Microprint is a rosin based solderpaste range which allows a previously unseen level of repeatability and consistency. Not only can this new solder paste technology offer the next step in process yield optimization, this technology heralds the way for lead free ready flux activation and gel/temperature stability.

Microprint Flux Type

Surface Insulation Resistance

10 Day Corrosion

Copper Mirror Corrosion

Fluoride Spot Test

J-STD-004 Rating

P2004

Pass

ROL1

P2005-L1

Pass

ROL1

NCJW0

Pass

ROL0

NCJW1

Pass

R0L1

Microprint Solder Paste Performance

Microprint	P2004	P2005L1	NCJW1	NCJW0
Tack Life	72Hrs	72Hrs	48Hrs	48Hrs
Wetting after 72 Hours Open time	3	4	5	5
Stencil Life	48Hrs	48Hrs	24Hrs	24Hrs
Cleaning Time Total Clean 440 @ 50°C	12min	12min	4min	4min
Humidity / Stability	4	4	4	5
Fine Pitch wetting	3	3	5	4
Lead Free Performance	3	3	5	5

Key: 5-Excellent, 4-Good, 3-Average,

Formulations to Suit All Applications

We hope the standard formulations available will suit most situations, however it is possible to modify features of Microprint to suit a particular application. If you have a requirement that Warton Metals can help you with, contact our technical department for advice on Tel: 01706 218888.

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solder paste - Microprint P2004 Slump Free No Clean

Warton Control Laboratories

Warton Metals Limited Grove Mill Commerce Street Haslingden Lancashire BB4 5JT England Telephone: +44 (0)1706 218888 Fax: +44 (0)1706 221188 E.mail: sales@warton-metals.co.uk

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