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Microprint
Slump Free No Clean Solder Paste
Microprint
is a rosin based solderpaste range which allows a previously
unseen level of repeatability and consistency. Not only can
this new solder paste technology offer the next step in process
yield optimization, this technology heralds
the way for lead free ready flux activation and gel/temperature
stability.
Microprint
solder paste has been carefully formulated to offer the maximum
in performance on tin/lead, copper, gold, nickel and silver
based substrate materials, to ensure optimum solderability
and minimum process difficulties when using either Sn62, Sn63,
or lead free alternatives (Sn96 or Warton lead free TSC (Sn/Ag/Cu)
offering a melting point of 217°C).
Microprint
is available in a particle size distribution of 15-32µm
or 25-53µm - offering repeatable print performance
for all aperture sizes including 0.6mm QFP's to below 0.3mm
µBGA's.
Microprint
P2004
Microprint
is a rosin based solder paste range which allows a previously
unseen level of repeatability and consistency. Not
only can this new solder paste technology offer the next
step in process yield optimization, this technology heralds
the way for lead free ready flux activation and gel/temperature
stability.
Microprint
has been carefully formulated to offer the maximum in performance
on tin/lead, copper, gold, nickel and silver based substrate
materials, to ensure optimum solderability and minimum process
difficulties when using either Sn62, Sn63, or lead free
alternatives (Sn96 or Warton lead free TSC (Sn/Ag/Cu) offering
a melting point of 217°C).
Microprint is available in a particle size distribution
of 15-32µm or 25-53µm - offering repeatable print performance
for all aperture sizes including 0.6mm QFP's to below 0.3mm
µBGA's.
Microprint
P2004 Datasheets
Batch
to Batch Consistency
Microprint
uses a unique gel system, resulting in greater batch to
batch consistency. This user friendly system simplifies
the set-up and control of the print process.
Microprint's
small particle size of 15-32µm (-450+600 mesh), guarantees
repeatable print definition to below 0.3mm for µBga work.
Microprint
helps eliminated mid chip and micro balling, therefore
eliminating costly rework.
Independently tested by a recognised test house
to ensure 'no clean' status in accordance with J-STD-004.
Please
find Trace Laboratories report below:
Microprint's
unique gel and 'no clean' activation system insures excellent
results with lead alloys 96S and Warton's low melt point
TSC alloy (217°C), enabling a hassle free change over
to lead free technologies.
Microprint
offers slump free processing.
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Microprint
P2004 Slump Performance
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Competitor Slump Performance
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Microprint
P2004 is available in 0.25Kg, 0.5Kg tubs, 40g and 75g
syringes, 0.5Kg and 1Kg cartridges, Pro Flow cartridges
and Paste Puck systems.
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