Microprint
is a rosin based solderpaste range which allows a previously
unseen level of repeatability and consistency. Not
only can this new solder paste technology offer the next
step in process yield optimization, this technology heralds
the way for lead
free ready flux activation and gel/temperature stability.
Microprint
Flux Type
|
Surface
Insulation Resistance
|
10
Day Corrosion
|
Copper
Mirror Corrosion
|
Fluoride
Spot Test
|
J-STD-004
Rating
|
|
P2004
|
Pass
|
Pass
|
Pass
|
Pass
|
ROL1
|
|
P2005-L1
|
Pass
|
Pass
|
Pass
|
Pass
|
ROL1
|
|
NCJW0
|
Pass
|
Pass
|
Pass
|
Pass
|
ROL0
|
|
NCJW1
|
Pass
|
Pass
|
Pass
|
Pass
|
R0L1
|
Microprint
Solder Paste Performance
|
Microprint
|
P2004
|
P2005L1
|
NCJW1
|
NCJW0
|
|
Tack Life
|
72Hrs
|
72Hrs
|
48Hrs
|
48Hrs
|
|
Wetting after 72 Hours Open time
|
3
|
4
|
5
|
5
|
|
Stencil
Life
|
48hrs
|
48hrs
|
24hrs
|
24hrs
|
|
Cleaning
Time Total Clean 440 @ 50°C
|
12min
|
12min
|
4min
|
4min
|
|
Humidity / Stability
|
4
|
4
|
4
|
5
|
|
Fine Pitch wetting
|
3
|
3
|
5
|
4
|
|
Lead Free Performance
|
3
|
3
|
5
|
5
|
Key:
5-Excellent,
4-Good, 3-Average
Formulations
to Suit All Applications
We
hope the standard formulations available will suit most
situations, however it is possible to modify features of
Microprint to suit a particular application. If you have a requirement that Warton Metals can help you with,
contact our technical department for advice on Tel: 01706
218888.
