Leading UK manufacturer of Solder Paste, Solid & Cored Solder Wires, Lead Free
& Rosin Free Solders, Fluxes, Cleaners and High Purity Bar Solder Products

Microprint P2006 Slump Free Solder Paste  

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The unique No Clean flux vehicle of Microprint P2006 offers excellent soldering of both tin/lead and lead free alloys. P2006 is designed for use with a variety of substrate materials including Sn/Pb, Au/Ni and OSP treated finishes. The solder paste is available with formulations to offer print speeds ranging from 20 to 300mm per second, with a Pin Testable formulation available, allowing easy penetration of test probes through the post soldering residues. Microprint P2006 is suitable for use with air and nitrogen reflow systems.

• Fast Print 20-300mm/sec.
• No Clean Type ROL0 J-STD 004
• Slump Free No Solder Balling
• Lead Free Ready -Sn/Ag/Cu (SAC) formulations
  

Slump Free - Eliminates Solder Balling

Microprint P2006 eliminates solder balling and mid-chip balling. One of the main difficulties with conventional gel systems is temperature instability or de-structuring of the gel matrix, this is evident not only in manufacturing of solder paste but during the reflowing of assemblies. If the gel matrix de-structures before sufficient solvent is volatilized, a washing effect takes place displacing solder particles between component legs or Mid-Chip.

Even though activator performance or Solderability issues can magnify this phenomenon Gel instability can be clearly demonstrated when high boiling point solvents are used to improve tack and stencil life.

The synthetic gel system adopted by Microprint offers stability at least 60°C higher than conventional gel. This yet again adds to the compatibility of Microprint with eco friendly 'lead free' applications as the problems with solder balling, with standard Sn/Pb formulations are intensified when using lead free alternatives.

Profile Friendly

By carefully monitoring activator performance at different profile temperatures, Warton have succeeded, not only in making Microprint profile friendly for conventional Sn62 and Sn63 alloys but also suitable for lead free processes. With careful manipulation, the same activator package can provide excellent activation at lower temperatures and can offer sustained activity for higher or longer temperature profiles.

This profile friendly approach allows the engineer to set the profile optimally for the process and defect minimization-and not the solder paste.

Printer Friendly

Microprint's printer friendly formulation offers consistent printing.

VOC Free Printing Operations

Advancement in solvent package technology means that during the printing and placement process Microprint is rated as VOC FREE in accordance to the European Solvent Directive, by which a VOC is defined by vapor pressure. This definition defines a VOC as having a vapor pressure of >0.1mbar. This definition applies to all industry sectors and is aimed at minimizing emissions of VOCs.

Cleanable after Reflow?

Yes, cleaning agents can readily remove the residues of Microprint P2006. Saponifiers such as Warton Metals Ltd TOTAL CLEAN 600 or TOTAL CLEAN 612 can easily remove all residues without leaving white staining or crystals normally associated with traditional rosin based pastes, recommended conditions can vary from 25-60°C for 2-5 minutes. Solvent cleaners can also be used such as TOTAL CLEAN 440 or aerosol cleaner TOTAL CLEAN 200. Stencil cleaning is simple with either TOTAL CLEAN Stencil wipes or TOTAL CLEAN 130 Stencil Cleaner.

Microprint P2006 Formulations and Performance

Microprint	P2006 Standard	P2006 (PT 300)
Flux Type J-STD-004	ROL0	ROL0
Alloys Available	Sn63 Sn62 TSC (SAC)	Sn63 Sn62 TSC (SAC)
Particle Size	20-45	20-45
Tack Life	72 hours	72 hours
Viscosity 10rpm (Malcom Spiral Pump Method	155 Pa.s	125 Pa.s
Print Speed	20-100mm/second	20-300mm/second

Microprint P2006 is lead free ready

Formulations to Suit All Applications

We hope the standard formulations available will suit most situations, however it is possible to modify features of Microprint P2006 to suit a particular application. If you have a requirement that Warton Metals can help you with, contact our technical department for advice on Tel: +44 (0)1706 218888.

Storage conditions

Store paste in at a temperature of -20°C to +5°C.
Allow paste to achieve ambient temperature before use.

Shelf Life

Solder Paste in Pro-Flow cassettes, tubs and cartridges that are stored correctly, will offer a shelf life of 12 months. Syringes will offer a shelf life of 6 months.

Technical Information

For further technical advice either by telephone or on-site, please do not hesitate to contact Customer Services on: + 44(0)1706 218888 or email: sales@warton-metals.co.uk.

Packaging

Microprint P2006 No Clean Solder Paste is available in 0.25Kg & 0.5Kg tubs, 40g and 75g syringes, 0.5Kg & 1Kg cartridges, Pro Flow and Paste Puck systems.