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Microprint P2005-L1 Slump Free Solder Paste 


Microprint P2005-L1 Slump Free Solder Paste

P2005-L1 offers a reduced viscosity version of the Microprint P2004 20-45mm Solder Paste.

P2005-L1 exhibits the same soldering performance and excellent post soldering residue appearance as P2004. P23005-L1 is rated J-STD-004 rating (ROL1) 0.48% halide.

Microprint Flux Type

Surface Insulation Resistance

10 Day Corrosion

Copper Mirror Corrosion

Fluoride Spot Test

J-STD-004 Rating

P2005-L1

  Pass

  Pass

  Pass

  Pass

 ROL1

Reflow Type

Available Particle Sizes

Sn62/Sn63 Air and Nitrogen Reflow

20-45mm (-325 +500 mesh)


Packaging

Microprint is available in 0.25Kg, 0.5Kg tubs, 40g and 75g syringes, 0.5Kg and 1Kg cartridges, Pro Flow cartridges and Paste Puck systems.

ISOQAR and UKAS Certification Future Autosol High Speed Cored Solder Wire  for automated and high speed soldering Ecowave Wave Soldering Flux Omega Rosin Free ProductsMicroprint Slump Free No Clean  Solder Paste Total Clean CFC Free Cleaning Solution

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