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Microprint
P2004 No Clean Solder Paste
Microprint Flux Type
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Surface
Insulation Resistance
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10
Day Corrosion
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Copper
Mirror Corrosion
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Fluoride
Spot Test
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J-STD-004
Rating
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P2004
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Pass
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Pass
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Pass
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Pass
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ROL1
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Suitable
for all ‘No Clean’ applications P2004 offers improved activation
whilst exhibiting the absolute minimum of clear post soldering
residue. Microprint P2004 no clean, is tested in accordance
with J-STD 004 type ROL1. Type ‘L1’ (Halide 0.48%)
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Reflow Type
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Available Particle Sizes
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| Sn62/Sn63
Air and Nitrogen Reflow |
15-32mm
(-450+635 mesh) |
Sn96/TSC/95A
Nitrogen Reflow
 |
20-38mm
(-400 +500 mesh) |
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20-45mm
(-325 +500 mesh) |
Batch
To Batch Consistency
Microprint
uses a unique gel system, resulting in greater batch to
batch consistency. This user friendly system simplifies
the set-up and control of the print process.
Greater
Print Definition
Microprint's
small particle size of 15-32µm (-450+600 mesh), guarantees
repeatable print definition to below 0.3mm for µBga
work.
Eliminates
Costly Rework
Microprint
helps eliminated mid chip and micro balling, therefore eliminating
costly rework.
Independently
Tested
Independently
tested by a recognised test house to ensure 'no clean' status
in accordance with J-STD-004.
Please find Trace Laboratories report below:-
REPORT.PDF
<
Click here to download Adobe Reader free
Microprint's
unique gel and 'no clean' activation system insures excellent
results with lead alloys 96S and Warton's low melt point
TSC alloy (217°C), enabling a hassle free change over
to lead free technologies.
Slump
Free Solder Paste
Microprint
offers slump free processing, which can be clearly seen
in the pictures below.
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Microprint
P2004 Slump
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Competitor
Slump
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Microprint is available in
0.25Kg, 0.5Kg tubs, 40g and 75g syringes, 0.5Kg and 1Kg
cartridges, Pro Flow cartridges and Paste Puck systems.
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