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Lead Free Solder Paste


Lead Free Solders in bar solder, cored solder

Warton manufacture a range of cored solder pastes which work with lead free alloys.

Microprint P2006 No Clean Solder Paste

The unique No Clean flux vehicle of Microprint P2006 offers excellent soldering of lead free alloys. P2006 is designed for use with a variety of substrate materials including Sn/Pb, Au/Ni and OSP treated finishes. The solder paste is available with formulations to offer print speeds ranging from 20 to 300mm per second, with a Pin Testable formulation available, allowing easy penetration of test probes through the post soldering residues. Microprint P2006 is suitable for use with air and nitrogen reflow systems.

  • Fast Print 20-300mm/sec.
  • No Clean Type ROL0 J-STD 004
  • Slump Free No Solder Balling
  • Lead Free Ready -Sn/Ag/Cu (SAC) formulations
Slump Free - Eliminates Solder Balling

Microprint P2006 eliminates solder balling and mid-chip balling. One of the main difficulties with conventional gel systems is temperature instability or de-structuring of the gel matrix, this is evident not only in manufacturing of solder paste but during the reflowing of assemblies. If the gel matrix de-structures before sufficient solvent is volatilized, a washing effect takes place displacing solder particles between component legs or Mid-Chip.

Even though activator performance or Solderability issues can magnify this phenomenon Gel instability can be clearly demonstrated when high boiling point solvents are used to improve tack and stencil life.

The synthetic gel system adopted by Microprint offers stability at least 60°C higher than conventional gel. This yet again adds to the compatibility of Microprint with eco friendly 'lead free' applications.

Profile Friendly

By carefully monitoring activator performance at different profile temperatures, Warton have succeeded in making Microprint profile friendly for lead free processes. With careful manipulation, the same activator package can provide excellent activation at lower temperatures and can offer sustained activity for higher or longer temperature profiles.

This profile friendly approach allows the engineer to set the profile optimally for the process and defect minimization-and not the solder paste.


PROFILE.PDF


Printer Friendly

Microprint's printer friendly formulation offers consistent printing.

VOC Free Printing Operations

Advancement in solvent package technology means that during the printing and placement process Microprint is rated as VOC FREE in accordance to the European Solvent Directive, by which a VOC is defined by vapour pressure. This definition defines a VOC as having a vapour pressure of >0.1mbar. This definition applies to all industry sectors and is aimed at minimizing emissions of VOCs.

Cleanable after Reflow?

Yes, cleaning agents can readily remove the residues of Microprint P2006. Saponifiers such as Warton Metals Ltd TOTAL CLEAN 600 or TOTAL CLEAN 612 can easily remove all residues without leaving white staining or crystals normally associated with traditional rosin based pastes, recommended conditions can vary from 25-60°C for 2-5 minutes. Solvent cleaners can also be used such as TOTAL CLEAN 440 or aerosol cleaner TOTAL CLEAN 200. Stencil cleaning is simple with either TOTAL CLEAN Stencil wipes or TOTAL CLEAN 130 Stencil Cleaner.

Microprint
P2006
Standard
P2006
(PT 300)
Flux Type
ROL0
ROL0
J-STD-004
   
Alloys Available
TSC (SAC)
TSC (SAC)
Particle Size
20-45
20-45
Track Life
72 hours
72 hours
Viscosity 10rpm
(Malcolm Spiral
Pump Method)
155 Pa.s
125 Pa.s
Print Speed
20-100mm/second
20-300mm/second


Formulations to Suit All Applications

We hope the standard formulations available will suit most situations, however it is possible to modify features of Microprint P2006 to suit a particular application. If you have a requirement that Warton Metals can help you with, contact our technical department for advice on Tel: +44 (0)1706 218888.

Storage Conditions

Store paste in at a temperature of -20°C to +5°C.
Allow paste to achieve ambient temperature before use.

Shelf Life

Solder Paste in Pro-Flow cassettes, tubs and cartridges that are stored correctly, will offer a shelf life of 12 months. Syringes will offer a shelf life of 6 months.

Technical Information

For further technical advice either by telephone or on-site, please do not hesitate to contact Customer Services on: + 44(0)1706 218888 or email: sales@warton-metals.co.uk.

Packaging

Microprint P2006 No Clean Solder Paste is available in 0.25Kg & 0.5Kg tubs, 40g and 75g syringes, 0.5Kg & 1Kg cartridges, Pro Flow and Paste Puck systems.


ISOQAR and UKAS Certification Future Autosol High Speed Cored Solder Wire  for automated and high speed soldering Ecowave Wave Soldering Flux Omega Rosin Free ProductsMicroprint Slump Free No Clean  Solder Paste Total Clean CFC Free Cleaning Solution

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