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The Future range of no clean solder pastes are designed for
applications requiring extreme low slump, no solder balling, excellent printability with long tack / stencil life. Future, offers rapid efficient
soldering of even the most difficult of assemblies, leaving only minimal clear
residue after reflow. Future is formulated for nitrogen and air
reflow processes and is available with both activated and halide free flux
formulations and in Lead Free (Lead free TSC and Sn96) and conventional lead
based alloys (Sn62 and Sn63).
Future P2001 No Clean Solder
Paste
A high density , superior activation,
high viscosity rosin based solder paste for applications requiring reliable
halide free flux residues with optimum solder-ability.
Future P2002 No Clean
Solder Paste
An extended stencil life / tack life
version of the P2001, but offering a slightly lower viscosity.
P2002 is designed for applications working with 25-50 thou pitch devices.
 Future P2003 Extended Tack & Stencil
Life Solder Paste
Future P2003 is a
Halide Free paste formulated for inert and aerobic applications. Future is
designed for applications requiring excellent printability with extended tack
and board/stencil life and excellent slump resistance. Future P2003 offers rapid efficient soldering of even the most difficult of
assemblies, leaving only minimal clear residue after reflow. Future No Clean is
available as Warton High Purity Sn63, Sn96 and Sn62 and Lead Free TSC and is
available in print or dispense grade with print life exceeding 24hrs and
tack/open time exceeding 72 hours. P2003 will allow the user to print boards on
Friday and reflow on Monday.
P2003 is formulated for
working with 16-50 thou pitch devices.
The table below shows the availability and
specification of the products in the Future range of solder pastes.
|
FUTURE NO CLEAN SOLDER PASTE |
P2001 |
P2002 |
 P2003 |
| Lead based Alloy |
Sn62, Sn63 |
Sn62, Sn63 |
Sn62, Sn63 |
| Lead Free Alloys |
Sn96, Lead Free TSC |
Sn96, Lead Free TSC |
Sn96, Lead Free TSC, 95A
|
| Flux Specification |
Halide Free |
Halide Free |
Halide Free |
| Particle Size |
25-63, 25-45, 25-38 |
25-63, 25-45, 25-38 |
25-38 , 25-45 |
| Viscosity (pa) |
950-1050 |
900-1000 |
600-800 |
| Metals Content
(%) |
90 |
90 |
89 (85
dispensing, 87 Lead Free TSC & Sn96) |
| Specification |
QQS 571E Type RMA,
IPC-SF-818 Class 3 |
QQS 571E Type RMA,
IPC-SF-818 Class 3 |
J-STD-004 Type
ROLO |
| Storage time |
6 months |
6 months |
6 months |
| Tack Time |
36 Hours |
36 Hours |
>72 Hours |
| Print Speed
(mil/sec) |
20-40 |
20-50 |
20-100 |
Packaging All
Solder Pastes are available in 0.25Kg, 0.5Kg,
1Kg and 5Kg tubs with 40g and 75g syringes,
0.5 and 1Kg cartridges.
To request a datasheet or to ask a representative to
contact you, please click on the INFORMATION
REQUEST FORM , E.mail sales@warton-metals.co.uk
or phone: +44 (0)1706 218888.
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