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The
Future range of no clean solder pastes are designed for applications
requiring extreme low slump, no solder balling, excellent
printability with long tack / stencil life. Future, offers
rapid efficient soldering of even the most difficult of assemblies,
leaving only minimal clear residue after reflow. Future
is formulated for nitrogen and air reflow processes and is
available with both activated and halide free flux formulations
and in Lead Free (Lead free TSC and Sn96) and conventional
lead based alloys (Sn62 and Sn63).
Future
P2001 No Clean Solder Paste
A
high density , superior activation, high viscosity rosin based
solder paste for applications requiring reliable halide free
flux residues with optimum solder-ability.
Future
P2002 No Clean Solder Paste
An
extended stencil life / tack life version of the P2001, but
offering a slightly lower viscosity. P2002 is designed
for applications working with 25-50 thou pitch devices.
Future
P2003 Extended Tack & Stencil Life Solder Paste
Future P2003 is a Halide Free paste formulated for inert and
aerobic applications. Future is designed for applications
requiring excellent printability with extended tack and board/stencil
life and excellent slump resistance. Future P2003 offers rapid
efficient soldering of even the most difficult of assemblies,
leaving only minimal clear residue after reflow. Future No
Clean is available as Warton High Purity Sn63, Sn96 and Sn62
and Lead Free TSC and is available in print or dispense grade
with print life exceeding 24hrs and tack/open time exceeding
72 hours. P2003 will allow the user to print boards on Friday
and reflow on Monday.
P2003
is formulated for working with 16-50 thou pitch devices.
The
table below shows the availability and specification of
the products in the Future range of solder pastes.
|
FUTURE
NO CLEAN SOLDER PASTE
|
P2001 |
P2002 |
P2003 |
| Lead
based Alloy |
Sn62,
Sn63 |
Sn62,
Sn63 |
Sn62,
Sn63 |
| Lead
Free Alloys |
Sn96,
Lead Free TSC |
Sn96,
Lead Free TSC |
Sn96,
Lead Free TSC, 95A
|
| Flux
Specification |
Halide
Free |
Halide
Free |
Halide
Free |
| Particle
Size |
25-63,
25-45, 25-38 |
25-63,
25-45, 25-38 |
25-38
, 25-45 |
| Viscosity
(pa) |
950-1050
|
900-1000 |
600-800 |
| Metals
Content (%) |
90 |
90 |
89
(85 dispensing, 87 Lead Free TSC & Sn96) |
| Specification |
QQS
571E Type RMA, IPC-SF-818 Class 3 |
QQS
571E Type RMA, IPC-SF-818 Class 3 |
J-STD-004
Type ROLO |
| Storage
time |
6
months |
6
months |
6
months |
| Tack
Time |
36
Hours |
36
Hours |
>72
Hours |
| Print
Speed (mil/sec) |
20-40 |
20-50 |
20-100 |
Packaging
All Solder
Pastes are available in 0.25Kg, 0.5Kg, 1Kg and 5Kg tubs with
40g and 75g syringes, 0.5 and 1Kg cartridges.
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