Solder Paste
Warton manufacture a range of solder pastes to meet the quality required for today's electronics industry.
Microprint is a rosin based solder paste range, which allows a previously unseen level of repeatability and consistency. Not only can this new solder paste technology offer the next step in process yield optimisation, this technology heralds the way for lead free ready flux activation and gel/temperature stability.
Microprint has been carefully formulated to offer the maximum in performance on tin/lead, copper, gold, nickel and silver based substrate materials, to ensure optimum solderability and minimum process difficulties when using either Sn62, Sn63, or lead free alternatives (Sn96 or Warton lead free TSC (Sn/Ag/Cu) offering a melting point of 217°C).
Microprint is available in a particle size distribution of 15-32µm or 25-53µm - offering repeatable print performance for all aperture sizes including 0.6mm QFP's to below 0.3mm µBGA's.
Microprint P2004
Microprint Flux Type |
Surface Insulation Resistance |
10 Day Corrosion |
Copper Mirror Corrosion |
Fluoride Spot Test |
J-STD-004 Rating |
P2004 |
Pass |
Pass |
Pass |
Pass |
ROL1 |
Batch to Batch Consistency
Microprint uses a unique gel system, resulting in greater batch to batch consistency. This user friendly system simplifies the set-up and control of the print process.
Greater Print Definition
Microprint's small particle size of 15-32µm (-450+600 mesh), guarantees repeatable print definition to below 0.3mm for µBga work.
Eliminates Costly Rework
Microprint helps eliminated mid chip and micro balling, therefore eliminating costly rework.
Independently Tested
Independently tested by a recognised test house to ensure 'no clean' status in accordance with J-STD-004.
Please find Trace Laboratories report below:
Lead Free Ready
Microprint's unique gel and 'no clean' activation system insures excellent results with lead alloys 96S and Warton's low melt point TSC alloy (217°C), enabling a hassle free change over to lead free technologies.
Slump Free Solder Paste
Microprint offers slump free processing.
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Microprint P2004 Slump Performance |
Competitor Slump Performance |
Packaging
Microprint P2004 is available in 0.25Kg, 0.5Kg tubs, 40g and 75g syringes, 0.5Kg and 1Kg cartridges, Pro Flow cartridges and Paste Puck systems.
Formore information contact sales@warton-metals.co.uk
Microprint P2006 Slump Free Solder Paste
Microprint Flux Type |
Surface Insulation Resistance |
10 Day Corrosion |
Copper Mirror Corrosion |
Fluoride Spot Test |
J-STD-004 Rating |
P2006 |
Pass |
Pass |
Pass |
Pass |
ROL0 |
The unique No Clean flux vehicle of Microprint P2006 offers excellent soldering of both tin/lead and lead free alloys. P2006 is designed for use with a variety of substrate materials including Sn/Pb, Au/Ni and OSP treated finishes. The solder paste is available with formulations to offer print speeds ranging from 20 to 300mm per second, with a Pin Testable formulation available, allowing easy penetration of test probes through the post soldering residues. Microprint P2006 is suitable for use with air and nitrogen reflow systems.
- Fast Print 20-300mm/sec.
- No Clean Type ROL0 J-STD 004
- Slump Free No Solder Balling
- Lead Free Ready -Sn/Ag/Cu (SAC) formulations
Slump Free - Eliminates Solder Balling
Microprint P2006 eliminates solder balling and mid-chip balling. One of the main difficulties with conventional gel systems is temperature instability or de-structuring of the gel matrix, this is evident not only in manufacturing of solder paste but during the reflowing of assemblies. If the gel matrix de-structures before sufficient solvent is volatilized, a washing effect takes place displacing solder particles between component legs or Mid-Chip.
Even though activator performance or Solderability issues can magnify this phenomenon Gel instability can be clearly demonstrated when high boiling point solvents are used to improve tack and stencil life.
The synthetic gel system adopted by Microprint offers stability at least 60°C higher than conventional gel. This yet again adds to the compatibility of Microprint with eco friendly 'lead free' applications as the problems with solder balling, with standard Sn/Pb formulations are intensified when using lead free alternatives.
Profile Friendly
By carefully monitoring activator performance at different profile temperatures, Warton have succeeded, not only in making Microprint profile friendly for conventional Sn62 and Sn63 alloys but also suitable for lead free processes. With careful manipulation, the same activator package can provide excellent activation at lower temperatures and can offer sustained activity for higher or longer temperature profiles.
This profile friendly approach allows the engineer to set the profile optimally for the process and defect minimization-and not the solder paste.
Printer Friendly
Microprint's printer friendly formulation offers consistent printing.
VOC Free Printing Operations
Advancement in solvent package technology means that during the printing and placement process Microprint is rated as VOC FREE in accordance to the European Solvent Directive, by which a VOC is defined by vapor pressure. This definition defines a VOC as having a vapor pressure of >0.1mbar. This definition applies to all industry sectors and is aimed at minimizing emissions of VOCs.
Cleanable after Reflow?
Yes, cleaning agents can readily remove the residues of Microprint P2006. Saponifiers such as Warton Metals Ltd TOTAL CLEAN 600 or TOTAL CLEAN 612 can easily remove all residues without leaving white staining or crystals normally associated with traditional rosin based pastes, recommended conditions can vary from 25-60°C for 2-5 minutes. Solvent cleaners can also be used such as TOTAL CLEAN 440 or aerosol cleaner TOTAL CLEAN 200. Stencil cleaning is simple with either TOTAL CLEAN
Microprint P2006 is lead free ready
Formulations to Suit All Applications
We hope the standard formulations available will suit most situations, however it is possible to modify features of Microprint P2006 to suit a particular application eg. Lead free fine pich or other alloys. If you have a requirement that Warton Metals can help you with, contact our technical department for advice on Tel: +44 (0)1706 218888.
Storage conditions
Store paste in at a temperature of -20°C to +5°C.
Allow paste to achieve ambient temperature before use.
Shelf Life
Solder Paste in Pro-Flow cassettes, tubs and cartridges that are stored correctly, will offer a shelf life of 12 months. Syringes will offer a shelf life of 6 months.
Technical Information
For further technical advice either by telephone or on-site, please do not hesitate to contact Customer Services on: + 44(0)1706 218888 or email: sales@warton-metals.co.uk.
Packaging
Microprint P2006 No Clean Solder Paste is available in 0.25Kg & 0.5Kg tubs, 40g and 75g syringes, 0.5Kg & 1Kg cartridges, Pro Flow and Paste Puck systems.
Furure P2003 No Clean Solder Paste
FUTURE NO CLEAN SOLDER PASTE |
P2003 |
Lead based Alloy |
Sn62, Sn63 |
Lead Free Alloys |
Sn96, Lead Free TSC, 95A |
Flux Specification |
Halide Free |
Particle Size |
25-38 , 25-45 |
Viscosity (pa) |
600-800 |
Metals Content (%) |
89 (85 dispensing, 87 Lead Free TSC & Sn96) |
Specification |
J-STD-004 Type ROLO |
Storage time |
6 months |
Tack Time |
>72 Hours |
Print Speed (mil/sec) |
20-100 |
Future P2003 is a Halide Free paste formulated for inert and aerobic applications. Future is designed for applications requiring excellent printability with extended tack and board/stencil life and excellent slump resistance. Future P2003 offers rapid efficient soldering of even the most difficult of assemblies, leaving only minimal clear residue after reflow. Future No Clean is available as Warton High Purity Sn63, Sn96 and Sn62 and Lead Free TSC and is available in print or dispense grade with print life exceeding 24hrs and tack/open time exceeding 72 hours. P2003 will allow the user to print boards on Friday and reflow on Monday.
P2003 is formulated for working with 16-50 thou pitch devices.
For more information contact sales@warton-metals.co.uk
The Company warrants only that the Goods will correspond as to the quality and description with the Company’s own specifications as set out in each product data sheet and all other terms conditions or warranties relating to the quality and/ or fitness for any particular purpose whether express or implied are excluded to the fullest extent permitted by law. It is therefore the Buyers responsibility to satisfy itself by inspection and testing of samples prior to placing any orders as to the purpose for which he requires the Goods and or particular conditions of use that will apply to the Goods and or the suitability or performance of the Goods when used in combination with any other Goods or materials, in any specific environment and in any process. In no event shall the Company be responsible for special, incidental or consequential damages, whether the claim is in contract, negligence or otherwise.
