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Future P2003 No Clean Solder Paste


Future P2003 No Clean Solder Paste is a Halide Free paste formulated for inert and aerobic applications. Future P2003 is designed for applications requiring excellent printability with extended tack and board/stencil life and excellent slump resistance.

Future P2003 offers rapid efficient soldering of even the most difficult of assemblies, leaving only minimal clear residue after reflow. Future P2003 is available as Warton High Purity Sn63, Sn96 and Sn62, Lead Free TSC, Sn10 and Sn5

Packaging

Future P2003 is available in 0.25Kg, 0.5Kg tubs, 40g and 75g syringes, 0.5Kg and 1Kg cartridges, Pro Flow cartridges and Paste Puck systems.


ISOQAR and UKAS Certification Future Autosol High Speed Cored Solder Wire  for automated and high speed soldering Ecowave Wave Soldering Flux Omega Rosin Free ProductsMicroprint Slump Free No Clean  Solder Paste Total Clean CFC Free Cleaning Solution

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