Future
P2002 No Clean Solder Paste is a Halide Free paste formulated
for nitrogen and air reflow applications. Future is designed
for applications requiring excellent printability with long
board/stencil life and extreme low slump.
Future
No Clean Solder Paste offers rapid efficient soldering of
even the most difficult of assemblies, leaving only minimal
clear residue after reflow. Future No Clean is available
as Warton High Purity Sn63, Sn96 and Sn62.
Future
P2002 is available in 0.25Kg, 0.5Kg tubs, 40g and 75g syringes,
0.5Kg and 1Kg cartridges, Pro Flow cartridges and Paste
Puck systems.