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Future Low Residue Flux Range


Future Low Residue No Clean Flux Range

A range of colophony and halide free, low solids content, no clean flux formulations for nitrogen applications. Future exhibits a low temperature (80-100°C) top side board temperature and no residue activity system, ensuring superior solderability with exceptional cleanliness. Future fluxes are controlled by specific gravity.

Future 315 Low Residue No Clean Flux

Future 315 is a 2% solids low residue, no clean, colophony free and halide free flux suitable for most no clean professional soldering applications. Future not only improves soldering performance (no bridges or icicles) but also reduces costs as cleaning is not necessary. Future 315 Low Residue No Clean Flux offers excellent solderability with the minimal level of flux residue.

Future 315 Low Residue No Clean is suitable for spray or foam fluxing systems.

Future 380F Low Residue No Clean Flux

Future 380F is a 2.5% solids, colophony and halide free, no clean flux suitable for most no clean professional soldering applications. Future not only improves soldering performance (no bridges or icicles) but also reduces costs as cleaning is not necessary. Future 380F Low Residue No Clean Flux offers excellent solderability with the minimal level of flux residue.

Future 380F Low Residue No Clean is suitable for spray or foam fluxing systems.

Future 380S Low Residue No Clean Flux

Future 380S has been specially formulated without the use of foaming agents.

Future 380S Low Residue No Clean Flux is a 2.5% solids colophony free and halide free flux suitable for most no clean professional soldering applications. Future not only improves soldering performance (no bridges or icicles) but also reduces costs as cleaning is not necessary.

Future 380S Low Residue No Clean Flux offers excellent solderability with the minimal level of flux residue.

Future 380S has been specially formulated for spray applications which require less residue and greater S.I.R values than conventional low solids no clean fluxes.

Packaging

Future fluxes are supplied in 5, 10, 25 and 205 Litre containers, (small sized containers 125cc, 0.5Litre, 1Litre are available on request).



ISOQAR and UKAS Certification Future Autosol High Speed Cored Solder Wire  for automated and high speed soldering Ecowave Wave Soldering Flux Omega Rosin Free ProductsMicroprint Slump Free No Clean  Solder Paste Total Clean CFC Free Cleaning Solution

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